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Samsung and AMD have expanded their partnership to supply next-generation memory for AI and servers. Under the latest ...

Samsung Electronics Co. is planning to triple its production of high bandwidth memory (HBM) this year from 2025 levels in ...

SEOUL, March 18 (Reuters) - Samsung Electronics and Advanced Micro Devices (AMD) signed a memorandum of understanding to expand their strategic partnership on memory chip supplies for artificial ...

CEO Lisa Su visited Samsung's chip production facilities, meeting with senior executives to discuss potential collaboration. The talks focused on foundry services and high bandwidth memory supply, ...

To strengthen their position in the growing industry of AI chips, Samsung Electronics and Advanced Micro Devices have signed a new agreement to expand their partnership on advanced ...

Samsung Electronics and AMD have signed a Memorandum of Understanding (MoU) to supply next-generation high-bandwidth memory for AMD's upcoming AI accelerators.

As part of the agreement, Samsung and AMD will coordinate the supply of Samsung's High-Bandwidth Memory (HBM4) for AMD's next-generation AI accelerator (Instinct MI455X) and optim ...

The collaboration will focus on supplying Samsung’s next-generation high-bandwidth memory (HBM4) for AMD’s upcoming Instinct ...

High-bandwidth memory becomes the choke point for AI accelerators as AMD plans Seoul meetings with Samsung and Naver, while supply forecasts, HBM4 roadmaps and packaging capacity reshape pricing power ...

TL;DR: Samsung offers its 12-layer HBM3E memory for NVIDIA's H20 AI GPU in China at prices 20-30% lower than SK hynix, aiming to disrupt the high-bandwidth memory market. Pending NVIDIA's quality ...

TL;DR: Samsung has secured a key HBM4 memory supply deal with NVIDIA, delivering up to 11Gbps chips for NVIDIA's 2026 Rubin AI GPUs. Utilizing advanced 10nm DRAM and 4nm logic, Samsung's ...