We have heard so much about floor planning for integrated circuits – routing, timing awareness, and even leakage and temperature awareness; how often do we come across the term Roof Planning in ...
As servers, routers and switching equipment shrink, managing the demand for more power in smaller packages is becoming an even bigger challenge for OEMs. Unlike signal connectors, which continue to ...
Experts at the Table: Semiconductor Engineering sat down to discuss power integrity challenges and best practices in designs at 7nm and below, and in 2.5D and 3D-IC packages, with Chip Stratakos, ...
For many years, power systems could be easily boiled down to a discussion of volts and amps. But for the past decade, the move to higher operating frequencies has brought another wrinkle to the power ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Tempus ™ Power Integrity Solution, the industry’s first comprehensive static timing/signal integrity ...
To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an ...
IC designers know the litany backwards and forwards: Area, power, and speed are the primary tradeoffs when it comes to optimizing your designs. You can usually have two out of the three, but a design ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence ® Voltus ™-XFi Custom Power Integrity Solution, a custom electromigration and IR drop (EM ...
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